Package Design Engineer
vor 2 Wochen
Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy-efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of today's customers and tomorrow too. If you love to be part of a high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an opportunity for you. We are actively seeking a Package Design Engineer, based at either of our locations: UK (Reading or East Kilbride/Scotland) or Switzerland (Lausanne) or Taiwan (Taipei) Responsibility and Authority Complete all Package design activities within the given time frame as defined by the project deliverables. Complete Package design review processes with the Assembly subcons to ensure no design rule violations. Liaise closely with the respective IC layout Engineers during Package design phase. Complete verification of Electrical characteristics of the package and unit design using available SW Tools. Ensure cost effective methodologies are incorporated into Kandou's BGA substrate and LF designs (Multi Layer / Mechanical Drill / Plating Lines etc). Provide support, guidance and instructions to Assembly / Package related activities, questions and issues. Present detailed weekly reports of activities and progress to the cross-functional team. Work with multi-functional groups including product design, engineering and marketing to ensure our package design/technology requirements are fully supported by Kandou's assembly partners. Required Competencies – Experience Minimum 5 years experience in IC Package Design using Cadence APD / SIP. Hands on experience using Cadence (Virtuoso / Extract IM / Power DC ) / Ansys SW Tools (SiWave / Q3D ) or similar tools. Experience using AutoCAD tool. Knowledge about various Electronic IC Packaging technology is a must. Basic understanding of Thermal and Mechanical behaviour of IC Packages. Basic understanding of IC physical layout is beneficial. Required Competencies – Skills Proven top-level Package design and RLC extraction experience. Ability to perform package parasitics extraction. Strong task management & planning ability. Proficiency in estimating timescales for design completion. Able to work to tight and variable time scales Strong interpersonal and communication skills. Good networking, negotiation and influencing skills Adept at managing communication with assembly subcontractors. If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It
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Package Design Engineer
vor 3 Wochen
Saint-Sulpice, Schweiz Kandou VollzeitChallenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy-efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of today's...
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Package Design Engineer
vor 1 Woche
Saint-Sulpice, Schweiz Hotel du Parc VollzeitPackage Design Engineer Postulation uniquement en ligne - merci de mentionner sous source ORP. Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy-efficient chip‑chip link solutions critical to the...
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Senior IC Package Design Engineer
vor 1 Woche
Saint-Sulpice, Schweiz Hotel du Parc VollzeitA semiconductor company is seeking a skilled Package Design Engineer in Saint-Sulpice, Switzerland. The position requires at least 5 years of experience in IC Package Design and proficiency in Cadence APD and Ansys tools. Responsibilities include overseeing package design activities and collaborating with cross-functional teams. Candidates must have a...
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Package Design Engineer
Vor 4 Tagen
Saint-Sulpice VD, Waadt, Schweiz Kandou Bus Vollzeit CHF 80'000 - CHF 120'000 pro JahrChallenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy-efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of today's...
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Senior Package Design Engineer – IC Packaging
vor 3 Wochen
Saint-Sulpice, Schweiz Kandou VollzeitA semiconductor company is seeking a Package Design Engineer in Switzerland. The ideal candidate will have over 5 years of experience in IC Package Design, proficiency with Cadence tools, and strong task management abilities. Responsibilities include overseeing package design activities and collaborating with engineering teams to ensure successful project...
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Senior IC Package Design Engineer
Vor 4 Tagen
Saint-Sulpice, Schweiz Kandou VollzeitA semiconductor company is seeking a Package Design Engineer to join their team in Switzerland. The ideal candidate will have over 5 years of experience in IC Package Design, specifically using Cadence APD and related tools. Responsibilities include leading package design activities, collaborating with IC layout engineers, and ensuring design adherence to...
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Senior Digital EDA/CAD Engineer – Tool Flows
vor 2 Wochen
Saint-Sulpice, Schweiz Kandou VollzeitA leading semiconductor company is seeking a Digital EDA/CAD Engineer to contribute to IC design tools and methodologies. This role involves collaboration with EDA/CAD vendors, training engineering teams, and developing robust design flows. The ideal candidate has over 7 years of extensive experience in digital design and strong programming capabilities....
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Memory Systems Engineer
vor 2 Wochen
saint-sulpice, Schweiz Kandou Bus VollzeitChallenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy-efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of today's...
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Digital Verification Engineer CH, UK, DE, DK
Vor 4 Tagen
Saint-Sulpice, Schweiz Kandou VollzeitChallenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of not just...
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Formal Verification Engineer CH, UK, DE, DK
Vor 4 Tagen
Saint-Sulpice, Schweiz Kandou VollzeitChallenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of not just...
