Package Design Engineer

Vor 4 Tagen

SaintSulpice VD, Waadt, Schweiz Kandou Bus Vollzeit CHF 80'000 - CHF 120'000 pro Jahr

Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy-efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of today's customers and tomorrow too. If you love to be part of a high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an opportunity for you.

We are actively seeking a Package Design Engineer, based at either of our locations: 

UK (Reading or East Kilbride/Scotland) or Switzerland (Lausanne) or Taiwan (Taipei)

Responsibility and Authority

  • Complete all Package design activities within the given time frame as defined by the project deliverables.
  • Complete Package design review processes with the Assembly subcons to ensure no design rule violations.
  • Liaise closely with the respective IC layout Engineers during Package design phase.
  • Complete verification of Electrical characteristics of the package and unit design using available SW Tools.
  • Ensure cost effective methodologies are incorporated into Kandou's BGA substrate and LF designs (Multi Layer / Mechanical Drill / Plating Lines etc).
  • Provide support, guidance and instructions to Assembly / Package related activities, questions and issues.
  • Present detailed weekly reports of activities and progress to the cross-functional team.
  • Work with multi-functional groups including product design, engineering and marketing to ensure our package design/technology requirements are fully supported by Kandou's assembly partners.

Required Competencies – Experience

  • Minimum 5 years experience in IC Package Design using Cadence APD / SIP.
  • Hands on experience using Cadence (Virtuoso / Extract IM / Power DC ) / Ansys SW Tools (SiWave / Q3D ) or similar tools.
  • Experience using AutoCAD tool.
  • Knowledge about various Electronic IC Packaging technology is a must.
  • Basic understanding of Thermal and Mechanical behaviour of IC Packages.
  • Basic understanding of IC physical layout is beneficial.

Required Competencies – Skills

  • Proven top-level Package design and RLC extraction experience.
  • Ability to perform package parasitics extraction.
  • Strong task management & planning ability. Proficiency in estimating timescales for design completion.
  • Able to work to tight and variable time scales
  • Strong interpersonal and communication skills.
  • Good networking, negotiation and influencing skills
  • Adept at managing communication with assembly subcontractors.

 If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It

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