Internship in Semiconductor Packaging

**Description**

**The opportunity**

**How you'll make an impact**
- Support technology development and research activities in the development of semiconductor power modules, i.e. process development and prototype manufacturing in a state-of-the-art cleanroom
- Perform accelerated lifetime testing, characterize modules before and after aging, supervise the test setup
- Perform first steps of the root cause analysis (X-ray, SAM, cross section etc.) and concisely document the test results
- Perform electromagnetic and thermal infinite element simulations to validate design features
- Create CAD designs of power modules in close collaboration with the team, find creative and efficient solutions to meet demanding and sometimes conflicting requirements

**Your background**
- Currently pursuing a M.Sc. degree in material science, electrical engineering, physics, chemistry or similar discipline (advanced B.Sc. or M.Sc. degree); official enrollment essential
- Experience in laboratory work, CAD and know-how in experimental methods using a wide range of advanced materials characterization techniques
- Solid programming skills (e.g. LabVIEW, Python, Matlab etc.)
- Experience with finite element modeling advantageous (ANSYS Q3D, COMSOL)
- Know-how in data analysis tools and statistics is advantageous
- Enthusiastic, self-motivated mindset and ability to work independently
- Highly conscientious individual with keen sense of responsibility
- Fluency in written and spoken English (any other language skills are a benefit) and good communication and technical writing skills
- Motivated and eager to learn more and become part of a multidisciplinary research team focused on innovation

**More about us**

Our flexible work practices help you optimize personal and business performance while creating an environment where all employees can develop their skills and grow.