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    Company Overview:Barrington James is a leading provider of recruitment services for the tech industry. We are currently seeking an experienced Thermal-Mechanical Engineer to join our team.Job Summary:Design and develop packaging solutions for photonic integrated circuits (PICs) and optical components.Create robust and reliable packaging designs that ensure...

Mechanical Engineer

vor 1 Monat


Lausanne, Schweiz Barrington James Vollzeit

To achieve the highest thermal and mechanical stability required for photonic integrated circuits (PICs) and optical packaging, we are looking for a Thermal-Mechanical Engineer who can help us optimize packaging design for reliability, performance, and manufacturability.

Responsibilities:

  • Create precisely constructed packaging for photonic integrated circuits (PICs) that ensures optical performance, mechanical stability, electrical connectivity, and thermal control.
  • To reduce heat-induced wavelength drift, design cooling solutions for photonic and electronic components utilizing techniques including heat sinks, TECs (thermoelectric coolers), thermal vias, and improved coatings.
  • To preserve alignment and stop performance degradation, select materials with the best thermal conductivity, thermal expansion coefficients (CTE matching), and optical qualities.
  • Create sealed and hermetic packaging options to protect parts from impurities including dust, moisture, and temperature changes.

Requirements:

  • Degree: Mechanical engineering, thermal engineering, photonics, semiconductor packaging, or a similar discipline at the bachelor's, master's, or doctoral levels.
  • Experience: at least five years in precision systems thermal/mechanical engineering, preferably in high-performance electronics, photonics, or semiconductor packaging.
  • Software Skills: Expertise with thermal simulation programs such as ANSYS, COMSOL, or Lumerical, as well as CAD programs like SolidWorks, AutoCAD, or comparable ones.
  • Industry Knowledge: It is very desired to have prior experience with optical packaging, semiconductor packaging, or microelectronics.
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